Soldermask on via holes There are 3 ways our customers prepare their layouts with respect to covering via-holes with soldermask: As necessary background information we need to briefly introduce you into the technology of applying soldermask to the boards. The easiest production method is to have all vias open from both sides. The vias will […]
Author Archive for: Lengyel Norbert
About Lengyel Norbert
This author has yet to write their bio.Meanwhile lets just say that we are proud Lengyel Norbert contributed a whooping 22 entries.
Entries by Lengyel Norbert
What is Bow and Twist? According to the IPC-A-600 standard bow and twist (flatness of the board) is : “Flatness of printed boards is determined by two characteristics of the product; these are known as bow and twist. The bow condition is characterized by a roughly cylindrical or spherical curvature of the board while its […]