Looking forward in 2016

In 2016 our focus will be on our core business processes, making them faster and more efficient.

In our BLOG looking back at 2015 we presented an overview of last years’ achievements. This year we are preparing ourselves to handle more than 100.000,- orders in our manufacturing and over 400.000,- data sets through our PCB Visualizer.

=> Improving speed, performance and efficiency will be our number one priority during the first 6 months of 2016.

Once the above goals have been achieved, we still have many exciting projects in the pipeline to help improve the products and services that we offer, with more yet to be revealed during the year:

  1. PCB Solver tools:

    2015 we made our PCB Visualizer vector based allowing more PRE-CAM tasks to be performed and allowing a better interaction with the user. Our goal is still to automatically process PCB data as far as possible through the CAM operations before our customers launch their orders. Simultaneously allowing customer interaction to solve potential production issues before they delay delivery or increase costs.

    What this means is that the data will be composed, like Gerber, of “real” entities (tracks, pads, planes, holes etc.). This allows for faster processing, but also opens the way for a whole range of new applications and repair solutions, for example, like auto repair of annular rings and outline editor as explained in our BLOG looking back at 2015.

    • When we prepare a job for production we run a number of routine automated procedures on our front-end engineering CAM systems (more). These adjust the design data to our manufacturing tolerances. The procedures include:
      • Preparing the soldermask to provide a minimum clearance from the copper pad, adequate cover over adjacent tracks, minimum webs between pads etc.(see our PCB Design Guidelines page 15)
      • Clipping the silkscreen to make sure that there is no ink on solderpads ( PCB Design Guidelines page 17)
      • Other adjustments as described in our BLOGS: Eurocircuits Data Preparation – Single Image 1 and Eurocircuits Data Preparation – Single Image 2.PCB Solver will automatically display the results of these procedures immediatly via the PCB Visualizer. You can exactly see what your finished board will look like before you place your order. If you find any potential issues, you have time to modify your design- or talk to our engineers via Online Chat.
    • PCB solver tools will continue to flag up DRC issues as they arise. The software will propose possible solutions based on the service specifications chosen and the options available in our CAM system. This may mean simply changing the classification of the job, but other options can include reducing a via-hole size, enlarging a pad size etc. Users will have the option to confirm the individual changes proposed by setting up approval rules (accept all changes, accept certain types of change, or confirm each case). The proposed solutions will be as described in our data preparation BLOGS Eurocircuits Data Preparation – Single Image 1 and 
      Eurocircuits Data Preparation – Single Image 2

  2. Assembly tools:

    • Solder paste editor. Edit solder paste pads on customer’s own paste layer or one generated by Eurocircuits. Functions include adding and deleting pads, as well as enlarging or shrinking them in X, Y or both. Add tooling holes or targets plus dimensions and positioning for the stencil.
    • Design for Assembly. Two predictive tools to help to detect locations where there is a risk of poor soldering.
      • Solder escape. Detect and flag places where solder could escape from the solder-pad, leaving a weak joint.

         

      • Solder bridge. Detect and flag potential solder shorts based on minimum isolation distances, soldermask configuration and solder process type.
         

  3. Services:

    • High definition solder mask. 2015, we have installed a Ledia direct imaging machine. This exposes standard photo-imageable soldermasks directly, without the need for phototools. Direct exposure allows narrower clearances between soldermask and copper pads as well as thinner webs between soldermask windows for easier and more reliable assembly of difficult components (QFN, BGA, small pitch, etc…). See our PCB Design Guidelines p. 15.

And we are looking forward to the finishing of our new building in Eger and our 25th anniversary on the 1st of May 2016!

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