Electronics & Application 2019

 

Beste Eurocircuits klant,

Van 14 tem 16 mei kan u het Eurocircuits team weer vinden tijdens het tweejaarlijkse Elektronicafeest “Electronics & Applications” op stand 7B054 in de Jaarbeurs te Utrecht.

Voor de 2019 editie hebben we met vele collega’s uit de branche Industriële Electronica van het FHI weer een zeer leuk beursgadget ontwikkeld. FLEX KLOK is een ontwerp van YMIF engineering en is een “nice to have” hebbeding waar zelfs de fijnste elektronicatechneut nog plezier kan aan beleven.

Registreer nu voor uw gratis toegangsbewijs voor de beurs en voor uw gratis exemplaar van de FLEX KLOK. Wacht niet te lang want er zijn maar 2.000 exemplaren beschikbaar.

Het zou ons verheugen er u te ontmoeten en u te informeren over de nieuwste ontwikkelingen bij Eurocircuits. Samen met onze mede exposanten vormen we toch het grootste tweejaarlijks Elektronica event van de BENELUX, een niet te missen afspraak.

Tot in Utrecht.

Het Eurocircuits Team.

 

 

MECSPE 2019

Buongiorno,

Eurocircuits esporra’ presso MECSPE – Parma, perche’non passate a trovarci per vedere le nostre ultime novita’ e le nostre offerte?

Dateci la possibilita’ di illustrarvi i nostri PCB e PCBA Visualizers che vi aiuteranno a creare un layout ottimale per il vostro PCB.

Vi aspettiamo.

Per ottenere il vostro biglietto di ingresso gratuito cliccate qui.

Dal team Eurocircuits.

 

 

 

Technical Specifications of all Eurocircuits Prototype & Small Volume Services – European Origin

PCB proto

STANDARD pool

RF pool

IMS pool

eC-Default Technology Values

Poolable Options

Non-Poolable Options

Poolable Options

Non-Poolable Options

Poolable Options

Non-Poolable Options

Number of layers

2, 4

0, 1, 2, 4, 6, 8

10, 12, 14, 16

2, 4

other – ask quotation

1

Max. PCB dimensions

425mm x 425mm, max 8.75dm²

425mm x 425mm, max 8.75dm²

425mm x 425mm and >8.75dm²,

larger – ask quotation

425mm x 425mm, max 8.75dm²

425mm x 425mm and >8.75dm²,

larger , ask quotation

550mm x 425mm, max 8.75dm²

550mm x 425mm and > 8.75dm²,

larger – ask quotation

Min. PCB dimensions

20mm x 20mm

5mm x 5mm

5mm x 5mm

5mm x 5mm

Base material

FR-4, Td>=325°C, T260>=60’, T288>=5’, CTEz=<3.5%, Tg>=150°C

FR-4, Td>=325°C, T260>=60’, T288>=5’, CTEz=<3.5%, Tg>=150°C

Isola 370HR, Td>=340°C, T260>=60’, T288>=30’, CTEz=<2.8%, Tg=180°C

2L – IS680, Tg 200°C

4L – IS680 + Isola 370HR , Tg180°C

Rogers RO4000 series, Tg280°C,

other – ask quotation

MOT=130°C, Tg100°C, >=1.3W/mK, CTI=600V, >=5kV, 0.77 K/W

Base material thickness: 0, 1, 2 layer

1.55mm

1.00mm, 1.55mm, 2.40mm

0.20, 0.36, 0.50, 0.80, 1.20, 2.00, 3.20mm

0.50mm other – ask quotation ALU 1.50mm, 100µm insulation

Base material thickness: Multi Layer

1.55mm

1.55mm

0.36, 0.50, 0.80, 1.00, 1.20, 2.00, 2.40, 3.20mm

1.55mm other – ask quotation

Base copper foil: 1 Layer

35µm/1oz

70µm/2oz-105µm/3oz

other – ask quotation

35µm/1oz

Base copper foil: 2 Layer

18µm/½oz

12µm/?oz-18µm/½oz-35µm/1oz

70µm/2oz-105µm/3oz

18µm/½oz

other – ask quotation

Base copper foil: Multi Layer

(outer layer – inner layer)

18µm/½oz OL – 35µm/1oz IL

12µm/?oz OL – 18µm/½oz IL,

18µm/½oz OL – 35µm/1oz IL

eC-predefined build ups,

any other – ask quotation

18µm/½oz OL – 18µm/½oz IL

other – ask quotation

Multilayer-build

eC-standard

eC-standard

eC-type 1-7, for specials “ask quotation”

eC-type 8

for specials “ask quotation”

Extra PTH cycles: blind – buried

build up to be checked by us

build up to be checked by us

Extra press cycles: sequential build up

build up to be checked by us

build up to be checked by us

Min. track width outer layer

0.150mm

0.100mm (max.18µm base Cu)

0.090mm (max.18µm base Cu)

0.100mm

0.090mm (max.18µm base Cu)

0.150mm

Min. spacing outer layer

0.150mm

0.100mm (max.12µm base Cu)

0.090mm (max.12µm base Cu)

0.125mm

0.090mm (max.12µm base Cu)

0.150mm

Min. annular ring outer layer

0.125mm

0.100mm

0.100mm

0.100mm

0.100mm

0.125mm

Min. track width inner layer

0.150mm

0.100mm (max.18µm base Cu)

0.090mm (max.18µm base Cu)

0.100mm

0.090mm (max.18µm base Cu)

Min. spacing inner layer

0.150mm

0.100mm (max.18µm base Cu)

0.090mm (max.12µm base Cu)

0.100mm

0.090mm (max.12µm base Cu)

Min. annular ring inner layer

0.125mm

0.125mm

0.125mm

0.125mm

0.125mm

Min. finished hole size

0.25mm

0.15mm

0.10mm, press fit holes

0.15mm

0.10mm, press fit holes

0.60mm

Min. outer layer pad diameter =

selected finished hole size + “value”

0.350mm (PTH)

0.250mm (NPTH)

0.300mm (PTH)

0.200mm (NPTH)

0.300mm (PTH)

0.200mm (NPTH)

0.300mm (PTH)

0.200mm (NPTH)

0.300mm (PTH)

0.200mm (NPTH)

0.250mm (NPTH)

Min. inner layer pad diameter =

selected finished hole size + “value”

0.350mm (PTH)

0.250mm (NPTH)

0.350mm (PTH)

0.250mm (NPTH)

0.350mm (PTH)

0.250mm (NPTH)

0.350mm (PTH)

0.250mm (NPTH)

0.350mm (PTH)

0.250mm (NPTH)

Min. Cu to board-edge – outer layers

0.250mm (routed)

0.250mm (routed), 0.450mm (V-cut)

0.250mm (routed), 0.450mm (V-cut)

0.250mm (routed), 0.450mm (V-cut)

Min. Cu to board-edge – inner layers

0.400mm (routed)

0.400mm (routed), 0.450mm (V-cut)

0.400mm (routed), 0.450mm (V-cut)

Extra features in copper

copper up to board edge, plated holes on the board edge, round edge plating

copper up to board edge, plated holes on the board edge, round edge plating

copper up to the board edge

Surface finish

lead-free finish at our discretion

for best price

lead-free for best price,

ENIG selective, LF HAL

ENIG overall, Im Ag, HAL Pb/Sn

ENIG selective

LF HAL, ENIG overall, Im Ag, HAL Pb/Sn

LF HAL

Soldermask type/colour

Liquid Photo Image able – green

LPI: green, black

LPI: blue, red, white, clear

LPI: green

LPI: blue, red, white, clear

LPI: white, black (white = default)

Legend colour

white (no, one or both sides)

white (no, one or both sides)

yellow, black, white PIL

white (no, one or both sides)

yellow, black, white PIL

black, white (black = default)

Extra options

peel able mask, via filling

gold fingers, carbon pads, heat sink paste

peel able mask, via filling

gold fingers, carbon pads, heat sink paste

Slots and cut-outs

2.0mm tool

0.5mm, 1.2mm, 2.0mm tool

0.5mm, 1.2mm, 2.0mm tool

2.0mm tool

Delivery panels (customer panels)

2.0mm break-routed, V-cut

2.0mm break-routed , V-cut

2.0mm break-routed , V-cut

Max. customer panel dimensions

350mm x 250mm

425mm x 425mm and >8.75dm²,

larger – ask quotation

350mm x 250mm

425mm x 425mm and >8.75dm²,

larger – ask quotation

550mm x 425mm, max 8.75dm²

550mm x 425mm and > 8.75dm²,

larger – ask quotation

Min. customer panel dimensions

50mm x 50mm

50mm x 50mm

50mm x 50mm

eC-registration compatible panel

Max 350mmx250mm, Min 50mmx50mm

Max 350mmx250mm, Min 50mmx50mm

Max 350mmx250mm, Min 50mmx50mm

Electrical test

standard

standard, option for 1L

standard

option

UL marking

available

available

not yet available

not yet available

Stencil material

130µm stainless steel

130µm stainless steel

130µm stainless steel

130µm stainless steel

Max. stencil size

595 x 595 mm

595 x 595 mm

595 x 595 mm

595 x 595 mm

The Eurocircuits default Technology Parameters are the values listed in the “PCB proto” column (except base material), these are also used in “STANDARD pool” and “RF pool.

In “STANDARD pool” and “RF pool” pooling limits and non-pooling limits are listed for all technology values.

For Tolerance Parameter relating to our PCB Services please see our current specification

To see all the eC-predefined build-ups for multilayers, please use the build-up wizard in our PCB Calculator program.

For all services the aspect ration is 1:8.

For more please see or current Classification Table in our PCB Design Guidelines.

See also our service for small and medium volume: “BINDI pool”– Eurocircuits” Asian alternative with European assured quality.