Initial start up of your eC-reflow mate

When starting up the eC-reflow-mate we would like you to check its initial start up values in the curves and oven parameters.
First connect the eC-reflow-mate to a PC with the USB cable and start up the eC-reflow-pilot software.

Firmware update for the eC-reflow-mate using the eC-reflow-pilot

  • You can update the firmware of the eC-reflow-mate and control this process from the eC-reflow-pilot.

Solder profiles and oven parameters for the eC-reflow-mate.

  • We deliver three profiles with the eC-reflow-pilot software: a lead free profile, a lead profile, and an IMS profile. The lead free profile is also preloaded in the eC-reflow-mate.

Where to place the PCB in the oven?

You need to place the PCB more or less in the middle of the oven between the furnace and the pre heater sensor. It is very important that the PCB is at least under the Furnace sensor so that this sensor is not receiving any radiation heat from the pre heater (bottom) IR-lamps. This to ensure that the temperature controller will function properly. (Very small boards can be placed on an older larger PCB or FR-4 piece of material.)

Thermal inertia – what it is and what are its effects

In the oven thermal inertia has two effects:

  1. Inertia in heating up the infrared lamps
  2. Inertia in heating up the PCB

Difference in soldering with or without space holders

  • With space holders we achieve a faster heat up (PCB is warmer).
  • Without space holder, the heat up is slower, because the bracket plate will take away the heat.

Which sensor regulates the temperature controller?

  • If both sensors (furnace and external sensor) are used, the sensor registering the highest temperature regulates the temperature controller.
  • If the external sensor is not used, the furnace sensor takes the controlling. Please be aware that the board could be warmer than the furnace temperature indicates. This is typically the case with heavy copper boards or IMS boards at the end of the solder curve due to temperature inertia.

How and where to place the external sensor on the PCB to be soldered?

  • Please make sure that the external sensor has contact with the soldered PCB.
    Due to the thermal inertia of the PCB, the sensor should not be placed over copper planes. It can be on a pad if that pad is not covered with solder paste (otherwise soldering will damage the sensor). Best it is placed on the solder mask free from copper underneeth (if this is not possible and heavy copper is there, you might need to adjust the temperature correction factor – see temperature correction.).

Correct placement of the sensor on the PCB

Sensor placed correctly on the PCB

Temperature difference between external sensor and furnace sensor.

A temperature difference between external sensor and furnace sensor could be normal. The furnace sensor simulated a standard PCB. The external sensor is measuring the actual temperature on the board. A difference of 30° could be quite normal.

Soldering with vs. without external sensors

  • Soldering some Printed Circuit Board protoypes:  start with external sensor and finish the rest of the run without external sensor. What do I have to pay attention to?
  • If you have measured a temperature difference (furnace higher than the external sensor), then you should compenstae for this diffenrence when removing the external sensor. Do this with the temperature correction parameter “temperature correction”.

How does the parameter temperature correction work?

Example: Temperature setting is 240°. Furnace is measuring 245°C and the External sensor is measuring 220°C.

eC-reflow-pilot – oven testing program

The ec-reflow-pilot can run a test program for the eC-reflow-mate to check its functionality.

When will the door of the eC-reflow-mate open?

The door opening point will depend one whether the eC-reflow-mate is operated in combination with the eC-relfow-mate-hood or not.