Technical Specifications of all Eurocircuits Prototype & Small Volume Services – European Origin

Number of layers

2, 4

0, 1, 2, 4, 6, 8

10, 12, 14, 16

2, 4

other – ask quotation

1

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Max. PCB dimensions

425mm x 425mm, max 8.75dm²

425mm x 425mm, max 8.75dm²

425mm x 425mm and >8.75dm²,

larger – ask quotation

425mm x 425mm, max 8.75dm²

425mm x 425mm and >8.75dm²,

larger , ask quotation

550mm x 425mm, max 8.75dm²

550mm x 425mm and > 8.75dm²,

larger – ask quotation

Min. PCB dimensions

20mm x 20mm

5mm x 5mm

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5mm x 5mm

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5mm x 5mm

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Base material

FR-4, Td>=325°C, T260>=60’, T288>=5’, CTEz=<3.5%, Tg>=150°C

FR-4, Td>=325°C, T260>=60’, T288>=5’, CTEz=<3.5%, Tg>=150°C

Isola 370HR, Td>=340°C, T260>=60’, T288>=30’, CTEz=<2.8%, Tg=180°C

2L – IS680, Tg 200°C

4L – IS680 + Isola 370HR , Tg180°C

Rogers RO4000 series, Tg280°C,

other – ask quotation

MOT=130°C, Tg100°C, >=1.3W/mK, CTI=600V, >=5kV, 0.77 K/W

–

Base material thickness: 0, 1, 2 layer

1.55mm

1.00mm, 1.55mm, 2.40mm

0.20, 0.36, 0.50, 0.80, 1.20, 2.00, 3.20mm

Base material thickness: Multi Layer

1.55mm

1.55mm

0.36, 0.50, 0.80, 1.00, 1.20, 2.00, 2.40, 3.20mm

Base copper foil: 1 Layer

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18µm/½oz, 35µm/1oz

70µm/2oz-105µm/3oz

–

other – ask quotation

35µm/1oz

–

Base copper foil: 2 Layer

18µm/½oz

12µm/?oz-18µm/½oz-35µm/1oz

70µm/2oz-105µm/3oz

18µm/½oz

other – ask quotation

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–

Base copper foil: Multi Layer

(outer layer – inner layer)

18µm/½oz OL – 35µm/1oz IL

12µm/?oz OL – 18µm/½oz IL,

18µm/½oz OL – 35µm/1oz IL

eC-predefined build ups,

any other – ask quotation

18µm/½oz OL – 18µm/½oz IL

other – ask quotation

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–

Multilayer-build

eC-standard

eC-standard

eC-type 1-7, for specials “ask quotation”

eC-type 8

for specials “ask quotation”

–

–

Extra PTH cycles: blind – buried

–

build up to be checked by us

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build up to be checked by us

–

–

Extra press cycles: sequential build up

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build up to be checked by us

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build up to be checked by us

–

–

Min. track width outer layer

0.150mm

0.100mm (max.18µm base Cu)

0.090mm (max.18µm base Cu)

0.100mm

0.090mm (max.18µm base Cu)

0.150mm

–

Min. spacing outer layer

0.150mm

0.100mm (max.12µm base Cu)

0.090mm (max.12µm base Cu)

0.125mm

0.090mm (max.12µm base Cu)

0.150mm

–

Min. annular ring outer layer

0.125mm

0.100mm

0.100mm

0.100mm

0.100mm

0.125mm

–

Min. track width inner layer

0.150mm

0.100mm (max.18µm base Cu)

0.090mm (max.18µm base Cu)

0.100mm

0.090mm (max.18µm base Cu)

–

–

Min. spacing inner layer

0.150mm

0.100mm (max.18µm base Cu)

0.090mm (max.12µm base Cu)

0.100mm

0.090mm (max.12µm base Cu)

–

–

Min. annular ring inner layer

0.125mm

0.125mm

0.100mm

0.125mm

0.100mm

–

–

Min. finished hole size

0.25mm

 0.10mm (PTH)

0.20mm (NPTH)

0.10mm, press fit holes

0.10mm (PTH)

0.20mm (NPTH)

0.10mm, press fit holes

0.60mm

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Min. outer layer pad diameter =

selected finished hole size + “value”

0.350mm (PTH)

0.250mm (NPTH)

0.300mm (PTH)

0.200mm (NPTH)

0.300mm (PTH)

0.200mm (NPTH)

0.300mm (PTH)

0.200mm (NPTH)

0.300mm (PTH)

0.200mm (NPTH)

0.250mm (NPTH)

–

Min. inner layer pad diameter =

selected finished hole size + “value”

0.350mm (PTH)

0.250mm (NPTH)

0.350mm (PTH)

0.250mm (NPTH)

0.300mm (PTH)

0.200mm (NPTH)

0.350mm (PTH)

0.250mm (NPTH)

0.300mm (PTH)

0.200mm (NPTH)

–

–

Min. Cu to board-edge – outer layers

0.250mm (routed)

0.250mm (routed), 0.450mm (V-cut)

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0.250mm (routed), 0.450mm (V-cut)

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0.250mm (routed), 0.450mm (V-cut)

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Min. Cu to board-edge – inner layers

0.400mm (routed)

0.400mm (routed), 0.450mm (V-cut)

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0.400mm (routed), 0.450mm (V-cut)

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–

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Extra features in copper

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copper up to board edge, plated holes on the board edge, round edge plating

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copper up to board edge, plated holes on the board edge, round edge plating

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copper up to the board edge

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Surface finish

lead-free finish at our discretion

for best price

lead-free for best price,

ENIG selective, LF HAL

ENIG overall, Im Ag, HAL Pb/Sn

ENIG selective

LF HAL, ENIG overall, Im Ag, HAL Pb/Sn

LF HAL

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Soldermask type/colour

Liquid Photo Image able – green

LPI: green, black

LPI: blue, red, white, clear

LPI: green

LPI: blue, red, white, clear

LPI: white, black (white = default)

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Legend colour

white (no, one or both sides)

white (no, one or both sides)

yellow, black, white PIL

white (no, one or both sides)

yellow, black, white PIL

black, white (black = default)

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Extra options

–

peel able mask, via filling

gold fingers, carbon pads, heat sink paste

peel able mask, via filling

gold fingers, carbon pads, heat sink paste

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–

Slots and cut-outs

2.0mm tool

0.5mm, 1.2mm, 2.0mm tool

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0.5mm, 1.2mm, 2.0mm tool

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2.0mm tool

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Delivery panels (customer panels)

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2.0mm break-routed, V-cut

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2.0mm break-routed , V-cut

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2.0mm break-routed , V-cut

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Max. customer panel dimensions

–

350mm x 250mm

425mm x 425mm and >8.75dm²,

larger – ask quotation

350mm x 250mm

425mm x 425mm and >8.75dm²,

larger – ask quotation

550mm x 425mm, max 8.75dm²

550mm x 425mm and > 8.75dm²,

larger – ask quotation

Min. customer panel dimensions

–

50mm x 50mm

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50mm x 50mm

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50mm x 50mm

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eC-registration compatible panel

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Max 350mmx250mm, Min 50mmx50mm

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Max 350mmx250mm, Min 50mmx50mm

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Max 350mmx250mm, Min 50mmx50mm

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Electrical test

standard, option for 1L

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standard

–

option

–

UL marking

available

available

–

not yet available

–

not yet available

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Stencil material

130µm stainless steel

130µm stainless steel

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130µm stainless steel

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130µm stainless steel

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Max. stencil size

595 x 595 mm

595 x 595 mm

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595 x 595 mm

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595 x 595 mm

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