Leitfaden
User Guide Description
Via in Pad
The Via in Pad technology proves to be a good technique to save real estate while making the layout of the PCB thus allowing denser boards with sticking to the standard technology Design Rule parameters.
By doing so one need to be aware of:
- Solder escape/wicking phenomena
- Tombstoning effects
- Use the via filling techniques as described here
Other ways to find help
Glossary
To simplify communication Eurocircuits uses abbreviations for many of these technical terms. Most of the
technical terms and abbreviations are international standards in the Printed Circuit Board manufacturing
industry. However to make it clear to everyone involved, we here present a list of technical terms and
abbreviations along with their explanation.
Still need help?
Talk to our customer support via our online chat, telephone or email.