Copper foil is the base copper thickness applied on outer and inner layers.
The Copper Foil can be pre-attached by the laminate manufacturer to a base material core or it can be introduced in a multi layer board as copper foil before pressing.
On inner layers the final copper thickness remains that of the base copper foil. On outer layers we deposit extra 20-30µm copper on the tracks during the galvanic process for plating through the holes.
For 1 layer and IMS boards there is no galvanic plating process.
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