In our website, documents and e-mail communication we use many technical terms as they are a part of the nature of our business. To simplify communication we also use abbreviations for many of these technical terms. Most of the technical terms and abbreviations are international standards in the Printed Circuit Board community. However to make it clear to everyone involved, we here present a list of technical terms and abbreviations used and their explanation. The order of items in this list is based on the order of their appearance in the Eurocircuits PCB calculator.

Definition
Short Description
Supporting Documents
1 PCB  Printed Circuit Board (also know as “the board”). Printed Circuit Board

Tolerances on PCB

2 TOP Top side of the PCB. Top side of the PCB

10 Rules for Better Data

3 BOTTOM Bottom side of the PCB. Bottom side of the PCB

10 Rules for Better Data

4 BUILDUP Defined build of a PCB such as number of layers an their sequence. PCB or Board Buildup

Buildup Wizard and Layer Editor

5 LAYER Individual layer of a PCB. LAYER of the Printed Circuit Board.
6 OUTER The Outer Layer(s) of the PCB either the TOP or BOTTOM side. OUTER Layer

Suggestions for Naming Your CAD-Data-Files

7 INNER The Inner Layer(s) of the PCB.  INNER Layer

Suggestions for Naming Your CAD-Data-Files

8 HOLE A hole that goes through the PCB from the Top Layer through to the Bottom Layer. NPTH – Non Plated Through Hole and PTH – Plated Through Hole

PCB Design Guidelines – Holes

9 VIA HOLES A hole that creates an electrically connected through the PCB. Via Hole

PCB Design Guidelines – Via Fill

10 SMD Surface mounted Device. Surface Mount Device
11 CORE A rigid base material laminate with copper on one or two sides. Core or Rigid Copper Laminated Base Material

PCB Multilayer Fabrication – Lay-up and Bond

12 PREPREG An unpressed base material without any copper foil. Prepreg or Unprocessed Copper Free Base Material

PCB Multilayer Fabrication – Lay-up and Bond

13 FR4 Fiberglass reinforced epoxy laminates that are Flame Retardant. Fiberglass Reinforced – Flame Retardant Base Material

How Often Can You Raise a Eurocircuits PCB to Lead-free Soldering Temperature

14 DELIVERY FORMAT The method in which you ask Eurocircuits to produce and delivery your PCB design. Delivery Format

Guidelines for customers that opt for the Eurocircuits standard panel

15 eC REGISTRATION COMPATIBLE PCB’s or Customer Panels that have the necessary Tooling Holes to be used with the Eurocircuits eC-stencil-mate or eC-stencil-fix equipment. eC-Registration Compatible

More on eC-registration

16 STENCIL Stainless Steel template for applying Solder paste onto the board. Stainless Steel template for applying solder paste onto the board

Laser stencil production video

Use of screen printer video

How to Order a Stencil?

17 PANEL BORDER Extra material around your PCB or multiple PCB’s to form a Customer Panel. Panel Border of a Customer Panel

Customer Panel Guidelines

18 PANEL CROSS OUTS A Panel where defective PCB’s have been visually crossed out. Panel without Cross Outs

Panel Editor

19 PANEL SPACING The PCB Spacing defines the extra space you want between different PCB’s on the Customer Panel. PCB Spacing on a Customer Panel
20 PCB SEPARATION METHOD Pre-cut the boards in a Customer Panel for easy removal after assembly. PCB separation method – on a Customer Panel

Panel instructions – V-cut basics

21 PANEL OUTLINE The required contour of a Customer Panel. Panel Outline
22 BOARD THICKNESS The thickness given in mm based on the base materials used including copper foil. Board Thickness
23 Tg Tg stands for Glass Transition Temperature and is one of the parameters of a base materials. Tg – material Tg
24 COPPER FOIL Copper Foils is the base copper thickness applied on OUTER and INNER layers. Copper Foil

PTH process video

25 EXTRA PTH RUN When producing multilayers with Blind and Buried Via Holes, the panel may need to pass through the galvanic Plating process multiple times. Extra PTH run
26 EXTRA PRESS CYCLES When producing Multi-layers with Blind and Buried Via Holes, additional Press Cycles may be required. Extra Press Cycles
27 BLIND and BURIED VIA HOLES Blind Via connects an Outer Layer to one or more Inner Layers but does not go through the entire board. A Buried Via connects two or more Inner Layers but does not go through to an Outer Layer. Blind and Buried Via

Blind and Buried Via’s Blog

28 Cu Cu is the chemical abbreviation for Copper Cu -Copper
29 TW The Track Width is specified in mm TW – Track Width

PCB Classification for Pattern and Drill Class

30 TT The Track to Track spacing specified in mm TT – Track to Track
31 TP The Track to Pad spacing is specified in mm TP – Track to Pad
32 PP The Pad to Pad spacing specified in mm PP – Pad to Pad
33 FINISHED HOLE SIZE The finished hole size or ENDHOLE is the diameter that the PCB designer specifies in his PCB layout. Finished Hole Size
34 PDH or TOOLSIZE The diameter of the Tool used in production to drill the hole. PHD – Production Hole Diameter
35 OAR Outer Layer Annular Ring OAR – Outer Annular Ring
36 IAR Inner Layer Annular Ring IAR – Inner Annular Ring
37 IPI Inner Layer Pad Insulation IPI – Inner Layer Pad Insulation
38 HOLE DENSITY The number of holes per dm² of the board surface. Hole Density
39 SM or SOLDERMASK A protective layer of liquid photo image able lacquer applied on the TOP and BOTTOM side of a Printed Circuit Board. SM-Soldermask
40 LEGEND Text printed on top of the Soldermask. Legend
41 LEAD FREE FINISH Final finish applied to the soldering areas of the PCB to prevent oxidation and to them easier to solder. Any Lead Free Finish

Which surface finish fits your design

42 HAL Hot Air Leveling Lead Free Tin (Sn) HAL Lead-Free
43 Ch Ni/Au or ENIG ENIG, Electro less Nickel Immersion Gold, also called Che Ni/Au, chemical nickel gold or also known as soft gold. Ch Ni/Au or ENIG (Electroless Nickel Immersion Gold)

Soldermask on via-holes in case of chemical Nickel-Gold surface finish

44 MILLING Used to form the contour of the PCB’s or Panels. Milling

Slots and Cut-outs

45 BARE BOARD TESTING Electrical Testing of the non populated PCB. Bare Board Testing
46 SHORT An electrical connection between two or more nets or isolated points that should not be connected. Short
47 OPEN A discontinuity or non-connection within a net . Open
48 LEAKAGE A type of short, sometimes referred to as a high-resistance short. Leakage
49 UL MARKING The Underwriters Laboratory (UL) UL Marking

What about UL ?

50 PEEL-ABLE MASK Also know as Peel-off Mask is a protective coating that can be easily removed. Peel-able Mask
51 CARBON CONTACTS Carbon Ink normally used for keyboard contacts, LCD contacts and jumpers. Carbon Contacts
52 SPECIFIC TOLERANCES Tolerances that are required to meet specific design goals and are not within the latest Industrial Standard IPC A-600 (x) Class II. Specific Tolerances
53  SPECIFIC MARKINGS  Customer specific markings such as logo, name, date code etc… Specific Marking

Marking Editor

54 PLATED HOLES ON THE BOARD EDGE Plated through holes in the edge of the board. Plated Holes on the Board Edge

Copper and the Board Edge

55 ROUND EDGE PLATING The edge of the board is plated with copper and then the final finish such as HAL. Round Edge Plating

Copper and the Board Edge

56 COPPER UP TO THE BOARD EDGE Copper is placed up to the very edge of the Board Contour. Copper up to the Board Edge

Copper and the Board Edge – Blog

57 PRESS-FIT HOLES Holes designed for the press fit of component leads, usually connectors. Press-Fit Holes
58 CHAMFERED MECHANICAL or COUNTERSUNK HOLES A beveled edge of a holes usually at 45 degrees. Chamfered Mechanical Holes or Countersunk Holes
59 DEPTH ROUTING Removing a specific area of the Outer Layer of the PCB to a specific depth. Depth Routing
60 EDGE CONNECTOR GOLD SURFACE A layer of gold plated to the fingers of the Edge Connector. Edge Connector Gold Surface

Gold Plating for Edge Connectors

61 EDGE CONNECTOR BEVELING Reduce the square edge of the connector to a sloping edge to ease entry in to the socket. Edge Connector Beveling
62 HEATSINK PASTE A paste used too fill Via Holes that are designed for Thermal dissipation. Heatsink Paste
63 VIA FILLING The filling of Via Holes with Resin or Soldermask. Via Filling

IPC-4761 Via Protection Type Classification

64 PLATING INDEX The density of the Copper distribution. Plating Index

Plating Simulation – our New Tool for PCB Designers

65 WARP and TWIST  The distortion of the PCB. Warp and Twist

Bow and Twist in Printed Circuits

66 FIDUCIAL An Optical target. Fiducial
67 MICRO SECTION of a PTH A cross section of a PTH Hole. Micro Section of a PTH
68 DELIVERY TERM Number of days required to manufacture. Delivery Term
69 SHIPMENT DATE  The date on which the order is shipped. Shipment Date

Info on Shipping

70 BOARD SURFACE The board surface area expressed in dm². Board Surface
71 ORDER SURFACE The total delivered PCB surface area of your order expressed in dm². Order Surface
72 NET PRICE The price excluding Taxes or VAT. Net Price
73 GROSS PRICE The price including VAT Gross Price
74 SINGLE PCB or SINGLE PANEL PRICE The price for one unit of the delivery format chosen in the calculator. Single PCB or Single Panel Price
75 BOARD PRICE The price includes the price for the PCB’s selected in the calculator Boards Price
76 TOTAL PRICE  The price for all selected items. Total Price

Info on Invoicing and Payment