Technical terms that are frequently used in the Printed Circuit Board manufacturing industry.

To simplify communication Eurocircuits uses abbreviations for many of these technical terms. Most of the technical terms and abbreviations are international standards in the Printed Circuit Board manufacturing industry. However to make it clear to everyone involved, we here present a list of technical terms and abbreviations along with their explanation.

Short Description
Supporting Documents
1BARE BOARD TESTINGElectrical Testing of the non-populated PCB.Bare Board Testing
2BLIND and BURIED VIA HOLESA Blind Via connects an Outer Layer to one or more Inner Layers but does not go through the entire board. A Buried Via connects two or more Inner Layers but does not go through to an Outer Layer.Blind and Buried Via

Blind and Buried Via’s Blog

3BOARD PRICEThe price includes the price for the PCB’s selected in the calculatorBoards Price
4BOARD SURFACEThe board surface area expressed in dm².Board Surface
5BOARD THICKNESSThe thickness given in mm based on the base materials used including copper foil.Board Thickness
6BOTTOMBottom side of the PCB.Bottom side of the PCB

10 Rules for Better Data

7BUILDUPDefined build of a PCB such as number of layers an their sequence.PCB or Board Buildup

Buildup Editor User Guide

8CARBON CONTACTSCarbon Ink normally used for keyboard contacts, LCD contacts and jumpers.Carbon Contacts
9CHAMFERED MECHANICAL or COUNTERSUNK HOLESA beveled edge of a holes usually at 45 degrees.Chamfered Mechanical Holes or Countersunk Holes
10Che Ni/Au or ENIG
(Electroless Nickel Immersion Gold)
ENIG, Electro less Nickel Immersion Gold, also called Che Ni/Au, chemical nickel gold or also known as soft gold.Ch Ni/Au or ENIG (Electroless Nickel Immersion Gold)

Soldermask on via-holes in case of chemical Nickel-Gold surface finish

11COPPER FOILCopper Foils is the base copper thickness applied on OUTER and INNER layers.Copper Foil

PTH process video

12COPPER UP TO THE BOARD EDGECopper is placed up to the very edge of the Board Contour.Copper up to the Board Edge

Copper and the Board Edge – Blog

13COREA rigid base material laminate with copper on one or two sides.Core or Rigid Copper Laminated Base Material

PCB Multilayer Fabrication – Lay-up and Bond

14CuCu is the chemical abbreviation for CopperCu -Copper
15DELIVERY FORMATThe method in which you ask Eurocircuits to produce and delivery your PCB design.Delivery Format

Guidelines for customers that opt for the Eurocircuits standard panel

16DELIVERY TERMNumber of days required to manufacture.Delivery Term
17DEPTH ROUTINGRemoving a specific area of the Outer Layer of the PCB to a specific depth.Depth Routing
18eC REGISTRATION COMPATIBLEPCB’s or Customer Panels that have the necessary Tooling Holes to be used with the Eurocircuits eC-stencil-mate or eC-stencil-fix equipment.eC-Registration Compatible

More on eC-registration

19EDGE CONNECTOR BEVELINGReduce the square edge of the connector to a sloping edge to ease entry in to the socket.PCB Design Guidelines – Edge Connectors

Edge Connector Bevelling

20EDGE CONNECTOR GOLD SURFACEA layer of gold plated to the fingers of the Edge Connector.Edge Connector Gold Surface

Gold Plating for Edge Connectors

21EXTRA PRESS CYCLESWhen producing Multi-layers with Blind and Buried Via Holes, additional Press Cycles may be required.Extra Press Cycles
22EXTRA PTH RUNWhen producing multilayers with Blind and Buried Via Holes, the panel may need to pass through the galvanic Plating process multiple times.Extra PTH run
23FIDUCIALAn Optical target.Fiducial
24FINISHED HOLE SIZEThe finished hole size or ENDHOLE is the diameter that the PCB designer specifies in his PCB layout.Finished Hole Size
25FR4Fiberglass reinforced epoxy laminates that are Flame Retardant.FR4 Quality – What to Expect

How Often Can You Raise a Eurocircuits PCB to Lead-free Soldering Temperature

26GROSS PRICEThe price including VATGross Price
27HALHot Air Leveling Lead Free Tin (Sn)HAL Lead-Free
28HEATSINK PASTEA paste used too fill Via Holes that are designed for Thermal dissipation.Heatsink Paste
29HOLE DENSITYThe number of holes per dm² of the board surface.Hole Density
30IARInner Layer Annular RingIAR – Inner Annular Ring
31INNERThe Inner Layer(s) of the PCB.INNER Layer

Suggestions for Naming Your CAD-Data-Files

32IPIInner Layer Pad InsulationIPI – Inner Layer Pad Insulation
33LAYERIndividual layer of a PCB.LAYER of the Printed Circuit Board.
34LEAD FREE FINISHFinal finish applied to the soldering areas of the PCB to prevent oxidation and to them easier to solder.Any Lead Free Finish

Which surface finish fits your design

35LEAKAGEA type of short, sometimes referred to as a high-resistance short.Leakage
36LEGENDText printed on top of the Soldermask.Legend
37MICRO SECTION of a PTHA cross section of a PTH Hole.Micro Section of a PTH
38MILLINGUsed to form the contour of the PCB’s or Panels.Milling

Slots and Cut-outs

39NET PRICEThe price excluding Taxes or VAT.Net Price
40OAROuter Layer Annular RingOAR – Outer Annular Ring
41OPENA discontinuity or non-connection within a net .Open
42ORDER SURFACEThe total delivered PCB surface area of your order expressed in dm².Order Surface
43OUTERThe Outer Layer(s) of the PCB either the TOP or BOTTOM side.OUTER Layer

Suggestions for Naming Your CAD-Data-Files

44PANEL BORDERExtra material around your PCB or multiple PCB’s to form a Customer Panel.Panel Border of a Customer Panel

Customer Panel Guidelines

45PANEL CROSS OUTSA Panel where defective PCB’s have been visually crossed out.Panel without Cross Outs

Panel Editor

46PANEL OUTLINEThe required contour of a Customer Panel.Panel Outline
47PANEL SPACINGThe PCB Spacing defines the extra space you want between different PCB’s on the Customer Panel.PCB Spacing on a Customer Panel
48PCBPrinted Circuit Board (also know as “the board”).Printed Circuit Board

Tolerances on PCB

49PCB SEPARATION METHODPre-cut the boards in a Customer Panel for easy removal after assembly.PCB separation method – on a Customer Panel

Panel instructions – V-cut basics

50PEEL-ABLE MASKAlso know as Peel-off Mask is a protective coating that can be easily removed.Peelable Mask
51PHD or TOOLSIZEThe diameter of the Tool used in production to drill the hole.PHD – Production Hole Diameter
52PLATED HOLES ON THE BOARD EDGEPlated through holes in the edge of the board.Plated Holes on the Board Edge

Copper and the Board Edge

53PLATING INDEXThe density of the Copper distribution.Plating Index

Plating Simulation – our New Tool for PCB Designers

Plating Index Solutions

54PPThe Pad to Pad spacing specified in mmPP – Pad to Pad
55PREPREGAn unpressed base material without any copper foil.Prepreg or Unprocessed Copper Free Base Material

PCB Multilayer Fabrication – Lay-up and Bond

56PRESS-FIT HOLESHoles designed for the press fit of component leads, usually connectors.Press-Fit Holes
57ROUND EDGE PLATINGThe edge of the board is plated with copper and then the final finish such as HAL.Round Edge Plating

Copper and the Board Edge

58SHIPMENT DATEThe date on which the order is shipped.Shipment Date

Info on Shipping

59SHORTAn electrical connection between two or more nets or isolated points that should not be connected.Short
60SINGLE PCB or SINGLE PANEL PRICEThe price for one unit of the delivery format chosen in the calculator.Single PCB or Single Panel Price
61SMD or Surface Mount DeviceSurface mounted Device.Surface Mount Device
62 SOLDERMASK (SM)A protective layer of liquid photo image able lacquer applied on the TOP and BOTTOM side of a Printed Circuit Board.SM-Soldermask
63 SPECIFIC MARKINGSCustomer specific markings such as logo, name, date code etc…Specific Marking

Marking Editor

64SPECIFIC TOLERANCESTolerances that are required to meet specific design goals and are not within the latest Industrial Standard IPC A-600 (x) Class II.Specific Tolerances
65STENCILStainless Steel template for applying Solder paste onto the board.Stainless Steel template for applying solder paste onto the board

Laser stencil production video

Use of screen printer video

How to Order a Stencil?

66TgTg stands for Glass Transition Temperature and is one of the parameters of a base materials.Tg – material Tg
67THROUGH HOLEA hole that goes through the PCB from the Top Layer through to the Bottom Layer.NPTH – Non Plated Through Hole and PTH – Plated Through Hole

PCB Design Guidelines – Drilled Holes

68TOPTop side of the PCB.Top side of the PCB

10 Rules for Better Data

69TOTAL PRICEThe price for all selected items.Total Price
Info on Invoicing and Payment
70TPThe Track to Pad spacing is specified in mmTP – Track to Pad
71TTThe Track to Track spacing specified in mmTT – Track to Track
72TWThe Track Width is specified in mmTW – Track Width

PCB Classification for Pattern and Drill Class

73UL MARKINGThe Underwriters Laboratory (UL)UL Marking

What about UL ?

74VIA HOLESA hole that creates an electrically connected through the PCB.Via Hole

PCB Design Guidelines – Via Filling

75VIA FILLINGThe filling of Via Holes with ResinPCB Design Guidelines – Via Filling

What is Via Filling

IPC-4761 Via Protection Type Classification

76WARP and TWISTThe distortion of the PCB.Warp and Twist

Bow and Twist in Printed Circuits