The Buildup Editor is a smart tool within the Visualizer which contains all our manufacturing capabilities and offers you price guidance to help you to define a cost effective buildup (or stackup) for your PCB.
To open the Buildup Editor click on either of the two ‘Buildup Editor’ buttons available in the PCB Configurator (center section of the PCB Visualizer).
This will open in a popup window in one of two different modes depending on whether PCB data is uploaded or not:
No PCB data uploaded or data uploaded with basic analysis.
PCB data uploaded and full analysis is completed.
Buildup Editor No Data or with Basic Analysis
The Buildup Editor is available when no data has been uploaded or when only a basic analysis has been run.
When it opens there will 3 sections available as below:
Material – for selecting the number of layers, base material and board thickness etc.
Buildup – a graphical representation of the chosen buildup.
Available buildups – shows the available predefined buildups that can be selected.
When you have completed all your changes please click on the ‘Apply’ button at the bottom of the window, this will close the editor and update the information in the PCB Configurator.
If you do not wish to keep the changes then click on the ‘Cancel’ button next to the ‘Apply’ button, this will close the editor and discard any changes you have made.
This section allows you to select the materials and configuration used for the buildup of your PCB and you can change the parameters which will be reflected graphically in the Buildup section.
If gold coins are displayed next to a parameter then this is an indication that the selected parameter will increase the cost of the PCB.
One coin stands for a small price increase but the selection stays poolable technology. A stack of coins stands for a non-poolable technology and thus a higher cost as we need to manufacture production panels filled with just this PCB.
Number of layers
Select the number of copper layers of the PCB
This represents the required nominal thickness of the PCB.
A normal buildup uses cores for the internal layers and prepreg covered in copper foil for the outer layers. Whereas, a reversed buildup uses cores for both inner and outer layers with prepreg between the cores.
Select the type of base material (from the dropdown list) to be used in the construction of your PCB.
The type of material available will depend on the service selected in the PCB Configurator (PCB Proto, STANDARD pool, DEFINED IMPEDANCE pool, RF Pool, etc.).
Blind and buried vias require additional manufacturing ‘runs’ as part of a sequential buildup.
If your design requires Blind or Buried vias then use this option to add them.
Adding Blind or Buried via runs
Select this option by clicking on the up arrow or by clicking on the ‘Add via’ button in the buildup section as below.
A popup will open where you can define on which layer the via starts and ends and click on the ‘Add’ button.
This will then update the image in the Buildup section showing the blind or buried via run added.
To add more runs click on the up arrow or the ‘Add via’ button again.
Removing Blind Buried via runs
If you wish to remove a run click on the down arrow or the ‘Remove via’ button and select which run to select from the popup and click on the ‘Remove’ button.
The run will be removed from the Buildup section.
A Via must always go through an even number of copper layers.
Vias cannot end at the top side of a core.
Vias cannot start at the bottom side of a core.
Blind or Buried Vias cannot start or end inside or at the end of another Blind/Buried via unless the one is completely enclosed within the other (this will add extra cost as an extra press cycle is required).