Track width

 

The Track Width (TW) is specified in mm and is one of the parameters that determines the pattern class of the board.

A typical TW value is 0.150mm or 6mil. This is the value for our pattern class 6 our standard.

We define OTW as Outer layer Track Width and ITW as Inner layer Track Width

 

See Eurocircuits Classification.

OTW or Outer layer Track Width

Outer layer track width

 

 

A : Resist width determined by the production master width.
B : Conductor base: position where the min. conductor width is measured.
C : Point of narrowest conductor width.
D : Cu-foil thickness.
E : Undercut.
F : Out growth (Fmax = A/8).
G : Overhang.

Etch-factor (D/E) >1

 

ITW or Inner layer Track Width

Inner layer trackwidth

 

 

 

A : Resist width determined by the production master width
B : Conductor base: position where the min. conductor width is measured.
C : Point of narrowest conductor width.
D : Cu-foil thickness.
E : Undercut

 

Etch-factor (D/E) >1

 

Track Width as defined by Eurocircuits

Track width may not be reduced to less than 80 % of the nominal value.

 

Edge definition

acceptable unevenness (U)(crest to trough) regarding track width and spacing.

Edge definition

nom. TT/TW U
120 µ 24 µ
150 µ 30 µ
200 µ 40 µ
300 µ 60 µ
500 µ 100 µ

 

There cannot be defects (edge roughness, nicks, pinholes, etc…) larger than 10% of the conductor length or more than 13mm whichever is less.

 

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