BGA/QFN/LGA

BGA (Ball Grid Array)

components are mostly used for microprocessors or flash memories. They provide more connection pins than other SMD components. There are solder balls at the bottom of the device. These solder balls melt during soldering and make the connection between the PCB and component.

LGA (Land Grid Array)

parts are similar to BGAs except that they do not have solder balls as leads but flat surface with pads. Most common LGAs are used as a physical interface for microprocessors. The contact between the device and component can be an LGA socket or it can be soldered directly to the PCB.

QFN (Quad Flat No-leads)

components are similar to LGAs but have some advantages, like small size, thin profile and low weight. Flat no-lead packages include and a central thermal pad to improve the heat transfer from the IC to and through the PCB. Heat transferring holes in the thermal pad on PCB must be drilled in a matrix format to prevent the component from rotating or tilting during the soldering process which would result in a poor thermal functionality.

Pitch

The minimum pitch size for us to place these three different parts is 0.4 mm.

However it might well be that a pitch of 0,4mm for for example a BGA, having many solder balls that need to be connected will lead to a PCB complexity et the level of HDI-boards. As Eurocircuits does not manufacture HDI boards and we always offer the combination of PCB + Assembly produced in-house, a pitch of 0,4mm for these components will often not be possible.

For BGA a pitch of 0,65mm will lead to a layout that still can be made with our pooling technology for the PCB and thus the cost for manufacturing will be more favourable. A good overview of minimum poolable design parameters is given here.

Package

The smallest package we can process is a 0201 package. The size of the 0201 package measures 0.024” by 0.012” or 0.6 mm by 0.3 mm.


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