WARR MOVE

The Munich Orbital Verification Experiment, abbreviated MOVE, is the satellite technology group of the Scientific Workgroup for Rocketry and Spaceflight (WARR e.V.). For 15 years it has been the core mission of the team to hands-on educate students via practical experience and offer them access to unique sources of knowledge. To this end, the team in-house-develops satellite hardware and tests it in space via so-called CubeSats – a standardised kind of nanosatellite. MOVE has already launched three 1U-CubeSats to space (satellites of size 10x10x11.3cm) and is still actively in contact with two of them.

Prototype of Move-III for a Stratospheric Balloon Test with Infrared Camera Payload.

During the recent sponsorship period, several PCB designs have been developed and improved, namely the COM-protoboard, which serves as an adapter board for the communication system, the undervoltage protection circuit (UVP), and two boards for a satellite payload (FEEHV and FEEAC). The payload is designed to measure sub-millimeter space debris composition and speed.

The COM-protoboard fits onto our standardised development subsystem boards (SSBs) and connects a COTS transceiver to our bus. For this, some additional components are needed that are also mounted on the front and back of the PCB.

The Communication boards for development phase.

On the FEEAHV board voltages of 150V and –150V are generated using an off-the-shelf dcdc converter and a charge pump for each voltage. These high voltages are used for the electrodes inside the sensor box of the DEDRA. The FEEAC amplifies small charges using several operational amplifiers and a logarithmic amplifier. The board also contains an ADC to interface to the digital electronics of the sensor and a DCDC converter to supply power to the different amplifiers.

The Eurocircuits sponsorship allows us to work with high-quality printed circuit boards that are manufactured and shipped very quickly. This is incredibly useful as it doesn’t interrupt our workflow and we can almost immediately start to assemble, test and use our PCB-designs.