Southern Manufacturing and Electronics Show 2012 a success

In February? In a tent? The SME show really shouldn’t work, but year after year, even through the snow, the visitors still arrive. This year there was no snow and a record attendance.

 

Dirk Stans, Uwe Doerr and myself were kept busy by visitors throughout. Uwe gave repeated demonstrations of the eC-stencil-mate solder-paste printer and the eC-reflow-mate reflow oven – and successfully. This was the first show ever where we sold both machines off the stand and they were on the users” premises within 3 days of the end of the show. There was plenty of active interest in our prototype and small batch pooling services. By the second day of the show we had received the first 2 day turnaround orders from a prospect we had met on day 1.

Missed us and want to know more about Eurocircuits and our products and services? Contact Patrick Martin on 07834 281514 or at patrick.martin@eurocircuits.com.

Eurocircuits integrates EAGLE CAD software

Eurocircuits integrates EAGLE CAD software

Eurocircuits have been appointed pan-European Value-Added Reseller for CadSoft’s EAGLE PCB design software. Now you can buy EAGLE CAD software licences and upgrades directly from our website on your Eurocircuits account – no need to set up new accounts and payment procedures. How?

 

 

 

Why do we offer a CAD package?

We want to offer our customers more than just a top quality prototype and small batch PCB service. We want to help them speed up their development cycle and get their products to the market faster. The key to this is integration. We want to provide the tools for an integrated workflow from design to assembled product. Whether you are a prototype designer or a small batch manufacturer, an integrated workflow will deliver faster product development with less risk of error and lower costs.

Downstream we have integrated our PCB and stencil products with reflow soldering. This is already showing benefits. Customers report that using our bench-top stencil printer they can cut assembly time by up to 75%. In particular the eC-registration system aligns the board and stencil fully automatically, cutting out the time-consuming manual alignment needed on traditional printers. Our bench-top reflow oven completes the process.

A CAD package allows us to integrate upstream.

Why EAGLE?


Because it has proved itself over the last 20 years to be one of the most popular CAD packages around. It is easy to learn, easy to use and affordable. It has a powerful range of functions and proven support. Find out more

 

 

What is EAGLE Integration?

We have been working closely with CadSoft for the last two years or so. It is already possible to upload EAGLE BRD data files directly into our system without the need for conversion. You can already use EAGLE design rule check templates (DRU files) to help you keep board costs down. Each DRU file reflects the specifications of one of our pooling services so you can make sure that your board fits the most cost-effective one.

Now in EAGLE V6 a new “PCB quote” button takes integration one step further. It directly enters the job parameters from EAGLE into our price calculators at the click of a mouse. To get a price or place an order all you need to type in is the number of boards you need and how quickly you want them. Board size, number of layers, material thickness, copper weights etc are all entered automatically from EAGLE. If you have used an Eurocircuits DRU file you will also know that your design fits perfectly into your chosen pooling service. See how it works.

Launch Discount

To launch this new service we are offering a discount key worth €30 against a Eurocircuits PCB order if you buy an EAGLE licence from us between now and 31 May 2012.

 

See the full * terms and conditions of the offer.

 

 

 

Eurocircuits BLOG”s

EAGLE integration is not the only extra service we are offering to PCB designers. Look on our home page for a wealth of technical papers, guidelines and videos on PCB design and manufacture. Feel free to comment on this BLOG post or on any of the others. If there are other topics you’d like us to BLOG or if you’d like to share a technical post with other Eurocircuits users, please tell us at euro@eurocircuits.com

Eurocircuits data preparation – Single Image (part I) – drill data and copper image

Have you ever wondered what we are doing to your data when the order status is Single Image? Here is the answer based on the instructions we give to our data preparation engineers. Many of the steps described below are automated for speed and accuracy but we have ignored this to make a clearer presentation. More information on our requirements can be found on the home page under “Technology Guidelines”.

Stage 2 – Single Image data preparation (Single Image and Single Image Cross Check)

The name “Single Image” may be slightly confusing as it includes both single circuits and customer panels or assembly arrays. We use it to mean what we will deliver to the customer (individual circuit or panelised array) in contrast to our pooled production panels.

Build the job

  • load the job data received from Stage 1 (Analysis of PCB CAD data)
  • remove everything outside the board outline.
  • build a job netlist from the drill and Gerber data. We will use this later to check that we have not made any mistakes during the data preparation. If you have supplied an IPC netlist from your CAD system we will check the job netlist against this at this stage and raise an exception if we find discrepancies.
  • save a copy of the layers as received as a reference for later checks.
  • load the correct build-up for the job using the material thickness/copper thickness etc specified in the order
  • save the job.

Prepare the drill layer(s)

  • calculate the Nominal Hole Size. Where our standard tolerances (+/- 0.1 mm) apply, the nominal hole size is the finished hole size specified in the data (e.g. 0.80 mm). Where the designer has specified his own tolerance (e.g. +0.1/-0.00) we will aim to produce a hole in the middle of this tolerance band (so the Nominal Hole Size will be 0.85 mm).
  • increase the Nominal Hole Size to the Production Hole Size to accommodate the plating on the hole walls, the mechanical tolerances of the drilling machines etc. This is to ensure that every finished hole size is within tolerance. The rules are:
    • plated holes with finished diameter of 0.45 mm or less (taken to be via holes): increase by 0.1 mm.
    • plated holes with finished diameter of 0.50 mm or more (taken to be component holes): increase by 0.15 mm.
    • non-plated holes: increase by 0.05 mm. This is due to the bounce-back of the laminate: the drilled hole is always slightly smaller than the drill diameter.
  • Sort and regroup all drills and slots in the correct functional drill layer.
    • Put all drill and slots – PTH and NPTH – to the first drill run
    • Move any NPTH drill, slot or inner cut-out that is or can be seen as part of the board profile to the profiling run.
    • Move all NPTH drills larger then 6.00mm to the profiling run.
    • Move all NPTH drills and slots that are in a copper area (pad or plane) to the second drill run or the profiling run as per production requirements.

There are 3 possible steps in the production flow where we can drill holes:

  • First Drill Run or plated drill layer:
      • This is one of the first steps in production. All holes drilled here will become plated (PTH)
      • unless the hole is being covered with dry film, this process is commonly known as “tenting”
  • or “tented NPTH hole”. Tented NPTH holes MUST have a copper clearance of 0.30mm and can
  • have a maximum size of 6.00mm.
  • Second Drill Run or non-plated drill layer:
    • Is performed after the electroless plating process (or blackhole process). All holes here are non-plated (NPTH)
  • Profiling run or rout layer:
    • Is the last step where the profiling of the board is done. These holes are also non-plated (NPTH)

Outer Layer preparation

  • Clean the data
    • Replace any painted pads and areas with proper flash pads and polygons. Painted features filled with small draws were common in old-fashioned standard Gerber data but are not needed with Extended Gerber where you can define any pad shape or filled area you require.


Check for missing copper pads on plated-through holes (PTH).

  • Check non-plated holes (NPTH)
    • Any NPTH hole which has a copper pad that is smaller than the hole, remove the copper pad
    • For the NPTH in the first drill run (Tented NPTH): Check the drill to copper clearance, it should be minimal 0.30mm.
      • Repair if needed by creating 0.30mm clearance to copper (=same repair methods/restrictions as Minimum copper to edge clearance in DRC – see article about Data Analysis)
      • If impossible to repair then move the NPTH to the second drill run or the profiling run as per production requirements.
  • Check and repair the copper free area of 0.25mm for all elements from the rout layer (=same repair methods/restrictions as Minimum copper to edge clearance in DRC)
  • Run automated design-rule checks (DRCs) to find violations against the minimum required design specifications of the chosen service. At this stage, any violation found should normally be repairable by us.

To ensure a robust end product with optimum plating, no drill breakout and, where relevant, good solderability, we look for a minimum annular ring of copper around the hole. This ring is measured from the production hole (the TOOLSIZE) which is oversized from the finished size (the ENDSIZE) to allow for the plating in the holes. For inner layers the annular ring required is larger than for outer layers to compensate for any movement in the material during bonding. For the values required see “PCB Classification” under “Technology guidelines” on our home page.
  • Check and repair minor copper defects which may cause problems in production: peelables (see PCB Design Guidelines p. 11), pinholes and copper slivers:
    • The dimensional values of the copper defects to be detected depend upon the pattern class – Peelables and Pinholes are filled, Slivers are removed.
  • Save the job.

Inner layer preparation

  • Clean the data as for outer layers.
  • Remove all non-functional pads
  • Check for missing copper pads on connected plated-through holes
  • Check and repair the copper free area of 0.25mm for all elements from the rout layer (=same repair methods/restrictions as Minimum copper to edge clearance in DRC).
  • Check and repair all thermal pads as needed
  • Check for proper thermal to plane connections, rotate the thermal if needed – Min thermal “air-gap” should be 0.20mm.
  • Run automated design-rule checks (DRCs) to find violations against the minimum required design specifications of the chosen service. At this stage, any violation found should normally be repairable by us.
  • Save the job.

This is the end of the drill data and copper image preparation. The next article will cover Soldermask preparation, Silk screen (legend), coding on PCB”s, making customer panels, machine outputs: “drill layer, rout layer, V-cut layer”, SMD paste layers and optional other layers.

Eurocircuits data preparation – Analysis

Have you ever wondered what we are doing to your data when the order status is Analysis or Single image? Here is the answer based on the instructions we give to our data preparation engineers. Many of the steps described below are automated for speed and accuracy but we have ignored this to make a clearer presentation. More information on our requirements can be found on the home page under “Technology Guidelines”.

Stage 1 – Analysis of PCB CAD data (Analysis and Analysis Cross Check)

Analyse the data files

  • Sort the data into Gerber files, Excellon drill files and any additional files (doc, txt, pdf, …) If the data comes in CAD format (EAGLE) convert into Gerber files, drill files etc.
  • Check the additional files: is there any job information there that is not in the Gerber/Excellon files or in the order (e.g. copper weights, soldermask colours, panel setup, tolerances, layer build-up etc)?

Convert the data into the format used by our data preparation software (DPF)

  • Upload and convert the Gerber and drill data. Is there critical information in aperture-lists, tool-lists or other files?
  • Check for undefined apertures or drill-tools (hole sizes) or 0-size apertures or drills

0-size aperture in the left image, should have been aperture 0.8 as in the right image.

Build the basic job


  • Give each file its proper description. These designators are used for subsequent automatic processing. The file may be:
    • a Copper layer: outer or inner
    • a Drill file: plated (PTH), -non-plated (NPTH), buried, blind
    • an Extra file: (solder)mask, silk(screen), rout, score, outline, paste, peeloff (mask), carbon,…
  • Stack the layers correctly in the job build
  • Align all layers exactly to each other.
  • Check that all layers “read” correctly. As we always view the data through the board from the top, the top layer should read correctly and bottom layers should be mirrored.
  • Reverse any “negative” plane layers where the Gerber image shows the pads etc that will be clear (not copper) in the finished board.
  • Create the outline layer. This layer represents the actual board size and shape.
  • Delete the board outlines from the other layers (but it’s a good idea to include them in the Gerber data so that we can make sure that all the layers are correctly aligned)
  • Save job

Mixed readable and mirrored text (left) – Top right corner cut out ? (right)

Check the data against the order and the specifications of the chosen service.

  • Check the job data against the order details:
    • number of layers, board size, single board or customer panel
    • soldermask and silk options
    • specific requirements such as edge plating, gold edge-connectors, carbon, peel-off mask, viafill etc.
    • specific requirements such as special build-ups, special materials, thickness of board and copper, specific tolerances, blind/buried vias.
  • Check the copper data against the drill files: are there any missing copper pads?
  • Check the drill data against the copper data: are there any missing drill holes?
  • Check the soldermask data against the copper pads: are there any missing soldermask pads (windows)?

Check the data against the minimum values of the chosen service

  • Check for minimum finished drill size: for example, a finished hole size less than 0.25 mm is not allowed in STANDARD pool.
  • Check for slot and cut-outs less than 0.50 mm in width – not allowed in any service.
  • Check for drill-drill distance <0.15 mm – not allowed in any service.
  • Run automated design-rule checks (DRCs) to find violations against the minimum required design specifications of the chosen service.
  • Any violation that is found will be evaluated:
    • Is it repairable by us without compromising the board functionality
    • Is the number of repairs or the complexity of the repairs needed in line with a normal data preparation process. Too much or too complex repairs are most often better solved on the customer side in the CAD system.
  • Following DRC checks are performed:
    • Minimum track width. Violations against minimum track-width will not be repaired by us
    • ]
    • Minimum isolation distance. Violations against isolation between tracks or between track and pad will not be repaired by us
    • Violations against isolation between track or pad and a copper plane can be repaired by locally withdrawing the copper plane area.
    • Repair is only possible if we do not create open nets in the copper plane.
    • Minimum ring of copper round drill holes on outer layers (Outer Annular Ring – OAR). OAR violations on via holes can be repaired by reducing the via drill size (the limit is the minimum via size for the pattern class) possibly in combination with enlarging the copper pad. All holes with finished diameter of 0.45 mm or less are considered being a via hole. OAR violations on component holes are repaired by enlarging the copper pad. The repairs can only be done provided they do not violate an isolation rule which cannot be repaired.
    • Minimum ring of copper round drill holes on inner layers (Inner Annular Ring – IAR) The same repair rules apply as for OAR violations.
    • Minimum edge of drill to copper clearance on inners for drills without copper pad (IPI). Minimum IPI value is set to minimum IAR + 0.075mm for the given pattern class:
    • Violations of IPI clearance on a copper plane are repaired by withdrawing the copper plane with the needed IPI clearance value. Repair is only possible if we do not create open nets in the copper plane. Violations of IPI clearance involving tracks can be repaired by moving the specific track away from the drill provided this is possible and that it does not create any insulation rule violation which is non repairable. Violations of IPI clearance involving pads are not repairable.
    • Minimum copper to edge clearance depending whether the board outline is to be routed or scored (V-cut) .
    • Violations against the edge clearance on a copper plane are repaired by withdrawing the copper plane with the needed edge clearance value, being 0.25mm for routed board outlines and 0.45mm for scored board outlines. Repair is only possible if we do not create open nets in the copper plane. Violations on the edge clearance involving tracks can be repaired by moving the specific track inwards the board provided this is possible and that it does not create any insulation rule violation which is non repairable. Violations on the edge clearance involving pads or drill holes are not repairable.

Move to next stage or raise an exception and halt the job

• If an exception (report of documentation problems) is required make an exception document:
  • summarize all the exceptions points
    • Data missing or unclear
    • Data incorrectly formatted or corrupted in transmission, not defined apertures or 0-size apertures
    • Readability not clear, Job build not clear,outline missing or not clear
    • The provided data do not correspond with the selections made in the order
    • DRC errors that cannot be repaired by us ( see above).
  • propose solutions where possible

• If no exception is required:
  • upload the job onto the system for next stage, single image preparation.
Our data preparation process consists of 3 steps :
  • The first step is the data analysis, what this document is about. Data analysis is performed on all inquiries placed with design files and on all orders. The purpose is to detect if the documentation provided is complete and useful to quote for or accept an order.
  • The second step is the single image preparation. In this stage we are preparing the layout so that it gets fit for production . More info about this stage follows here
  • The third step is the panelizing of different jobs on a production panel – we come back in detail to this later also.

The pictures shown in the articles about data preparation are based on real pcb orders, but have been modified to show specific problems and solutions.

Eurocircuits Then and Now

The Eurocircuits website – Then and Now – From website to online ERP system

We have come a long way, the simple website we launched to let customers calculate and order the PCBs online has grown into a complete ERP system now. But the initial philosophy to create one unique platform where all information is available to both customers as internal staff remains the same even now. This post is an attempt to give you a glimpse of evolution of the website.

The Beginning (2000-2002) – version 1

Homepage - Year 2002


The home page in year 2002 when we first officially launched the service.

Price calculator - year 2002

The price calculator in year 2002. This first version included flow management for orders already, but was limited to only simple pooling orders.

The change (2004) – version 2

Homepage - Year 2004

The home page in year 2004, in this year we have done a major change in terms of technology we used, the entire system was recreated from ground up. The requirements to extend the offer of Eurocircuits could not be incorporated in the original version anymore

Revisions (2005-2008) – version 3

During the years 2005 to 2008, the customer site as well as the internal administrative interface was continuously changed and improved. New software tools became available that offered more convenience for customers to place and track their orders. More functionality was built in the background so that all administrative and commercial tasks were transferred from external systems to the online system.

The current system

Home page - Year 2012 Price calculator - Year 2012

What you see now is the website version we have been working on since beginning of year 2009 and eventually launched it on May 2010. It was built again from ground up with major user interface improvements for both customers as well as for our internal staff. Since 2011 there are two systems in place,

  • Webbased interface for customers to request offers, place orders, retrieve documents and manage their profiles and communications.
  • Webclient system (called ECC) for our internall staff in sales, frontend engineering, production, logistics and finance that manages the complete flow of quotations, orders, files and documents through the different entities in the Eurociruiits group.

And we continue to develop. All remarks and suggestions from customers and Eurocircuits staff are evaluated and new requirements are coming daily. Keeping up with the expectations of more than 6500 customers and 400 staff members remains a challenge for the software team every day.

Hand-soldering – point by point or mini-wave technique

Hand-soldering with the same high quality result as reflow or wave soldering?

Are you ready for the challenge ? Let us look at the mini-wave soldering technique.

This picture shows that tools and skills are the basics to achieve a good result in hand-soldering. You agree ?

Hand-soldering is in most cases the last step in the prototype assembly process. Why is it less controlled and more difficult than other steps in the manufacturing. It is something we all know how to do. It”s just heating up a PCB and a component to make a solder joint. Isn”t that simple?

PCB designers, technicians, electronics engineers, we all learned at school how to solder with an iron. It can be 5 or 35 years ago, but we assume that not a lot has changed. A lot did change!

Do we still take our car to a service where they have only mechanical hand-tools to fix it ? They do have a lot of tools these days to do a good repair job.

 


Soldering connections – Solderjoint

A good solderjoint is an electrical and mechanical connection which in the best condition is made in one shot with a temperature as low as possible, and as quick as possible. This rule is still valid, even when solder-alloys have changed from Sn63/Pb37 to the leadfree SAC305, SN100,.. or whatever the alloy used.

A good iron and the right skills makes the perfect start. What is the temperature of your iron today? How is the geometry and condition of your tip? What solder-materials do you use? Are you soldering leadfee assemblies?

 

 

Today we show you a technique to solder a SOIC-16 (Small outline Integrated Circuit 16 I/O) or PQFP-100 with Gull Wing leads. The quality we like to match is the same or even better than in a full automated production line. We all know how to solder this point by point, but do we master the Mini-wave technique?

 

 

 

 

See more details from the SOIC in the package outline

What do we need :

  • Soldering station (iron)
  • Soldertip
  • Solderwire
  • Flux past / Flux pen
  • Tweezer
  • Cleaning product
  • EPA zone ( ESD protected area)

How do we proceed:

  • Set the temperature as low as possible considering the pcb design ( layers, copper mass )
  • Insert the tip into the soldering iron
  • Heat-up the tip and check the tip conditions: the solder should flow (spread evenly) over the plated tip area.
    • If this is not the case, clean the tip surface ( to remove oxidation)
    • if this does not help, replace the tip with a new one.
  • Place the SOIC 16 on the PCB and attach 2 or 4 corners to hold the component in place ( Apply flux to the pads before placing the SOIC on the board)
  • Add flux paste or flux to all leads/pads on the SOIC16
  • Clean the solder-tip on a wet sponge or brass tip cleaner
  • Add solder to the tip-end (miniwave or conical tip)
    • Point by point soldering: {flowplayer}http://www.eurocircuits.com/images/stories/Movies/point-by-point-soldering.flv{/flowplayer}
      • Solder all leads individually – point by point by adding the right amount of solder. The solder is provided by hand using a fine solderwire.
    • Mini-wave soldering: {flowplayer}http://www.eurocircuits.com/images/stories/Movies/mini-wave-soldering.flv{/flowplayer}
      • Place the mini-wave tip ( parallel to the pads) on the first pin of the PQFP/SOIC and move along the pins at a constant speed. Solder all leads in less then 5-10 seconds.
      • Do the same thing again on the other sides of the PQFP/SOIC
  • Clean all Flux-residues with a cleaning solvent and ESD-safe trigger grip
  • Check all solderjoints/connections with a microscope/videomicroscope/magnifier.


The difference between both techniques is that the point to point technique takes much more time than the mini-wave technique. With the point to point technique it is also more difficult to have an even quantity of solder on all the joints.

 

New PCB services from Eurocircuits at Southern Manufacturing and Electronics 2012

Southern Electronics logoWhat’s new on the Eurocircuits stand M31 at Southern Manufacturing and Electronics this year?

1. New lower prices.

For prototype and small batch PCBs 1 – 4 layers we have cut our How can we do this? We have invested over £1,000,000 last year in new capacity.

2. New faster pricing and ordering.

Get immediate prices online for all our pooling services without registering as a user – and store your prices in a basket for later ordering. Or order at once – your order goes straight into production with no administration delay.

3. New PCB proto service option for lowest prices.

Now you can order just one 2 or 4 layer PCB on deliveries from 2/3 – 7 days to get lowest possible prices

4. New Design For Manufacturability (DFM) tool.

An even copper density ensures optimum plating quality. Our new plating simulation tool can help to achieve this. Use our “Place Inquiry” option and our engineers will produce a full manufacturability report on your board including a copper density visualisation map. DFM analysis can cut board costs up to 20%.

5. New technical support resources.

The “PCB Design Guidelines” document on our home-page www.eurocircuits.com gets more that 60,000 hits a year. Now we have added more technical papers as well as technical blogs and videos to help you design more robust and lower cost PCBs.

6. New bench-top reflow soldering equipment.

We will show the latest models of our eC-stencil-mate solder-paste printer and eC-reflow-mate reflow oven, upgraded after feedback from more than 200 users in first 9 months of sales.

What’s old on the stand?

A warm welcome from our PCB and reflow-soldering experts ready to show you all the new features and answer your questions.

Can’t make the show? Check out the new features on our website or this blog, or contact Patrick Martin on 07834 281514 or at patrick.martin@eurocircuits.com.

Eurocircuits Sales figures 2011

Presentation of the sales results 2011

Sales

2011 was a good year. For the first time our PCB turnover exceeded 15M€. The total consolidated group turnover including equipment sales amounts to 16.9M€.

Overall sales increased 3.57% against 2010. Our online pooling services showed a healthy growth in sales value of 14.14 %.

The turnover evolution in PCB sales over the last 5 years is as follows :

  • 2007 – 11.9 million €
  • 2008- 11.8 million €
  • 2009- 11.8 million €
  • 2010- 14.8 million €
  • 2011- 15.4 million €


The 2008-2009 financial crisis is clearly visible in the figures, but could not stop us from resuming our growth path again from 2010 on.

 

Customers

The number of different customers ordering from Eurocircuits in a given year is growing steadily, and was not affected by the economical downturn of 2008-2009

  • 2007 : 3461 customers ordering
  • 2008 : 3893 customers ordering
  • 2009 : 4507 customers ordering
  • 2010 : 5692 customers ordering
  • 2011 : 6485 customers ordering or a growth of 13.93 % over 2010

Orders

All these customers are placing a growing number of orders:

  • 2007 : 35.834 orders processed
  • 2008 : 38.569 orders processed
  • 2009 : 42.614 orders processed
  • 2010 : 50.015 orders processed
  • 2011 : 53.168 orders processed or a growth of 6.3 % over 2010

Production units.

This continuing growth in number of orders could no longer be managed by our main production unit in Hungary, Eurocircuits Kft. So in 2009 we bought a second production unit in Aachen – Germany, Eurocircuits Aachen GmbH. Both units together guarantee an excellent delivery performance and give us the necessary extra capacity to continue our growth.

Eurocircuits Kft in Eger, Hungary processes 51 % of the orders and counts for 70% of our turnover

Eurocircuits Aachen GmbH processes 49 % of the orders and counts for 30% of our turnover

Delivery terms.

For many years we have seen an increasing demand for shorter delivery terms. For prototypes and small batches (=<50dm²) up to 4-layer boards, we shortened our standard delivery term to 7 working days. Our shortest delivery term is now 2 working days for 1-, 2- and 4-layer boards and 3 working days for higher layer counts (see our calculation tool). When there is a need for even shorter delivery terms we are willing to explore the possibilities. Help us to make the right choices by participating in the following poll:

{jvotesystem poll==3}

eC-Workshop: Prototypen perfekt SMD-Bestücken (Germany)

Mehr als 150 Kunden kauften bereits das eC-reflow-equipment von Eurocircuits.

Überzeugen auch Sie sich in einem Workshop von der Qualität, Einfachheit und Zuverlässigkeit unserer professionellen Lösung zur Prototypen-Bestückung.

Der erste Workshop findet am 23.02.2012 um 10:30 in 41812 Erkelenz statt. Bei Bedarf werden wir weitere lokale Workshops organisieren.

Da die Teilnehmerzahl für die kostenlose Vorführung begrenzt ist, bitten wir Sie bei Interesse für einen Workshop das zutreffende Formular auszufüllen:

  • Ich möchte am Workshop am 23.02.2012 in Erkelenz teilnehmen:
  • Ich möchte an einem Workshop zu diesem Thema zu einem späteren Zeitpunkt teilnehmen (Sie werden informiert)
  • Ich möchte mehr Informationen zu diesem Thema, ohne an einem Workshop teilzunehmen

Hier erhalten Sie Informationen zu unserem eC-reflow-equipment:

Allgemeine Informationen zum eC-reflow-equipment

Informationen zu eC-stencil-mate

Informationen zum eC-reflow-mate

Informationen zu eC-reflow-pilot

 

We plan to organise eC-Workshops on PCB prototype assembly in other countries also in the future. When you want to be informed when there is a workshop in your area,pre-register here and we will keep you updated.

Visit our calendar to see all upcoming events

Eurocircuits – healthy results for 2011 – and that’s not just the MD

Eurocircuits annual sales meeting took place in Mechelen 11 – 13 January.

Luc Smets and Dirk Stans, Managing Partners, opened the meeting with a summary of the company”s results for 2011 which showed a healthy growth in turnover, number of orders and number of customers.
They also outlined new developments for 2012 which will significantly enhance the services which we provide for our customers.  More information on these will be available on the website and in our blog as they are released over the next few months.
Gabor Wachter and Olaf Davidsmeyer, Managing Directors of the Eger and Aachen factories respectively, described their investments in new equipment during 2011 and their plans for 2012.
Total investment for 2011 was in excess of €1,300,000  Our investments have increased capacity by 40% as well as improving quality.
By removing bottlenecks in production we have further increased the reliability of our deliveries.
We had an excellent dinner for all participants and the associates based in Mechelen.
Lively conversations in 5 languages continued into the small hours.
The company”s green credentials were emphasised by Luc Smets arriving each day by tricycle. He showed his concern for the health of his colleagues by leading two of them on a 30 km tricycle ride after the meeting ended.”