Hi-speed designs seminar

Modern EDA-software like Eagle makes creating complex layouts a lot easier than it has been in the past. However there are still challenges one has to face when using state of the art technology. Especially hi-speed designs that make use of DDR2/3-RAM and fast serial interfaces like LVDS and hi-speed USB may pose a challenge. This workshops deals with the issues that arise when creating layouts for such hi-speed designs. One needs to consider suitable multilayer-stackups as well as controlled impedance and signal propagation delay. There are a lot of tools available to help with these issues, but most of these tools are quite expensive. In this workshop, Mr Benedikt Heinz will examine how to create sophisticated hi-speed layouts using Eagle and tools that are either open-source of free of charge.

  • EMV issues
  • selection & placement of decoupling caps
  • multilayer stackups
  • transmission lines for PCBs (microstrip, stripline, coplanar waveguide, differential lines)
  • selection of suitable transmission lines and geometry calculations
  • simulation of transmission lines using LTspice
  • termination options for transmission lines
  • signal propagation and length matching
  • routing of DDR(2/3) memory busses and differential serial busses
  • verifying signal integrity in practice
  • transmission line calculation
  • transmission line simulation using LTspice


Participation fee : 415€ (incl. VAT)
This participation fee includes the necessary material, seminar documentation, lunch and a participation certificate.

Seminar

04-Apr-2017

Register here

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Eurocircuits Aachen GmbH

Peter-Debye-Str. 4, 52499 Baesweiler, Germany

Event date and time:

April 4th

9.00 AM – 4.30 PM

Who is Mr Benedikt Heinz ?

  • Studied in Augsburg, where he got a Graduate Degree in Computer Science.
  • During his studies he was a firmware / electronics developer.
  • Since more than 15 years, Mr Heinz focuses on microcontrollers (AVR, 8051, PIC, ARM).
  • Since about 9 years also on FPGAs.
  • After his studies, Mr Heinz worked at the Fraunhofer Institute in Garching. Topics there are : Embedded Systems Security, Side-channel attacks.
  • Since the beginning of 2015 he is active independently in the area of Digital design HW- / SW development with a stronger focus on hi-speed boards (DDR2 RAM, HDMI, SATA, PCI Express).
  • Also active as a developer of open-source tools for hi-speed designs.