RF pool
RF pool High Frequency Board Service
Made in Europe
Eurocircuits’ PCB RF pool service offers designers of High Frequency Board the cost benefits of order-pooling.
RF pool covers a broad spectrum of technology including 2 types of material, 2- and 4-layer PCB’s plus a range of build-up options including mixed RF and FR4, all at acceptable prices.
For other RF requirements, upload your data via the Ask for quotation box for our engineers to evaluate.
What’s Available
- Bare Board or Assembled PCB’s
- Bare Board PCB’s in 5 Working Days* or Assembled PCB’s in 10 Working Days*
- Isola I-TERA & Rogers RO4350 for pooling – Rogers 4003 series Non-pooling
- 2 & 4 Layers pooled from 1 piece onwards
- 100µm Track & Gap pooling – 90 µm Non-pooling
- 2 Soldermasks – 2 Legends/Silkscreens
- Lead-free Finish (electroless nickel immersion gold or lead-free HAL)
- No Tooling Charges
- No Minimum Order Charge.
- 100% Manufacturability Check Prior to Production
- 100% Electrical Test
- PCB Configurator to check and upload design parameters before pricing
- PCB Checker to analyses your data before you place your order
- BOM and CPL analysis
| RF pool Service Parameters | |
Number of Layers | Pooling – 2 & 4 Non-Pooling – 1,6,8,10,12,14,16 |
Maximum PCB Dimension | 355mm x 500mm for ML 425mm x 580mm for 0L, 1L & 2L |
Minimum PCB Dimension | 5mm x 5mm |
Base Material | I-TERA – Tg 200°C Rogers R04350 – Tg 280°C Non-Pooling – Rogers R04003 – Tg 280°C |
Prepreg for Multilayers | Isola PCL370HR – Tg 170-180°C |
Board Thickness – 0, 1, 2 Layer | 0.250mm & 0.500mm Non-Pooling – others available in the online calculator |
Board Thickness – 4 layer | 1.00mm & 1.55mm Non-Pooling – others available in the online calculator |
Board Thickness – 6, 8, 10, 12. 14 & 16 layer | 1.55mm Non-Pooling – others available in the online calculator |
Base Copper Foil – Outer Layers | Pooling – 1L & 2L – 12µm, 18µm, 35µm Pooling – Multilayers – 12µm, 18µm Non-Pooling – others available in the online calculator |
Base Copper Foil – Inner Layers | Pooling – 18µm. 35µm Non-Pooling – others available in the online calculator |
Surface Finish | Pooling – ENIG (Chemical Ni/Au), LF HAL, IM Ag |
Soldermask Type/Colour | Pooling – Green Non-Pooling – Red, Blue, Black White, Transparent, PixtureBlackWhite |
Extra Options | Pooling – Peelable mask, Via filling, Heatsink Paste Hard-gold fingers, Edge Connector Bevelling, Gold Edge Connectors Non-Pooling – Carbon Pads |
Legend Colour | Pooling – White Non-Pooling – Black, WhitePIL |
Min. Track width/Spacing | Pooling – 0.100mm Non-Pooling – 0.090mm |
Min. Finished Hole Size | PTH – 0.100mm NPTH – 0.200mm Non-Pooled – others available in the online calculator |
Minimum Outer Layer Pad Diameter | PTH is Finished Hole Size + 0.300mm NPTH is Finished Hole Size + 0.200mm |
Minimum Inner layer Pad Diameter | PTH is Finished Hole Size + 0.350mm NPTH is Finished Hole Size + 0.250mm |
Minimum Copper to Board Edge Clearance – Outer layers | Routed – 0.250mm V-cut – 0.450mm |
Minimum Copper to Board Edge – Inner Layers | Routed – 0.400mm V-cut – 0.450mm |
Copper Options | Copper up to Board Edge Plated Holes on Board Edge Round-edge Plating |
Slots and Cut-outs | Tool Sizes – 0.5, 1.2 & 2.0mm |
Delivery Panels (customer panels) | Break-routed with 2 mm Tool or V-cut |
Maximum Customer Panel that can be eC-compatible | Pooled – 350 x 250mm |
Multilayer Build | Standard, eC-type 8, eC-type 9 For specials request a quotation |
Electrical test | Standard |
UL Marking | Not yet available |
Stencil Material | 100µm and 130µm Stainless Steel |
Maximum Stencil Size | 595mm x 595mm |
The RF pool service starts with Default Values, as described in this article
| RF pool Assembly Service Parameters | |
Number of Component Layers | 1 or 2 |
Quantities | 1 Piece and Onwards |
Lead Time | 10 working days* (5 for manufacture and 5 for assembly) |
Minimum PCB Dimensions | 5mm x 5mm |
Maximum Customer Panel | 326mm x 426mm |
Assembly Type | SMT – single or double sided THT – single or double sided SMT + THT Mixed Technology – single or double sided |
Components | Passive Components – 0201 and higher Active Components – from 0,35mm pitch BGA – 0,4mm pitch and above |
Solder Alloy | Basis SAC 305 Sn 96,5 Ag3 Cu 0,5 lead-free |
Solder Paste Stencil | Laser cut (included in the assembly cost – not delivered with the assembled boards) |
Component Sourcing | All Components Sourced by Eurocircuits (Components not sourceable by Eurocircuits can be supplied by the customer) |
Quality Inspection | Visual inspection Solder Paste Inspection (SPI) BGA Placement X-ray Inspection |
*Notes
- Subject to design meeting our RF pool manufacturing and assembly specification and component availability.
- The price cannot be automatically calculated for a PCB containing more than 200 BOM lines or 1000 component placements, our engineering department will evaluate and send you an offer usually within 24 hours.
- These conditions are available in our calculator/Visualizer and will only be confirmed in our order confirmation.
