RF pool

RF pool High Frequency Board Service

Made in Europe

Eurocircuits’ PCB RF pool service offers designers of High Frequency Board the cost benefits of order-pooling.

RF pool covers a broad spectrum of technology including 2 types of material, 2- and 4-layer PCB’s plus a range of build-up options including mixed RF and FR4, all at acceptable prices.

For other RF requirements, upload your data via the Ask for quotation box for our engineers to evaluate.

What’s Available

  • Bare Board or Assembled PCB’s
  • Bare Board PCB’s in 5 Working Days or Assembled PCB’s in 5 Working Days
  • Isola I-TERA pooled – Rogers 4000 series Non-pooled
  • 2 & 4 Layers pooled – up to 16 Layers non-pooled
  • 100µm Track & Gap pooled – 90 µm Non-pooled
  • 2 Soldermasks – 2 Legends/Silkscreens
  • Lead-free Finish (electroless nickel immersion gold or lead-free HAL)
  • FR-4 – RoHS Compliant Material Optimised for Lead-free Soldering (see also our blog about materials and lead-free soldering)
  • No Tooling Charges
  • No Minimum Order Charge.
  • 100% Manufacturability Check Prior to Production
  • PCB Configurator to check and upload design parameters before pricing
  • PCB Checker to analyses your data before you place your order
  • BOM and CPL analysis

RF PCB Image

Free On-Line Price Button

RF pool Service Parameters

Number of Layers

Pooled – 2 & 4

Non-Pooled – 1,6,8,10,12,14,16

Maximum PCB Dimension

355mm x 500mm  for ML

425mm x 580mm for 1L & 2L

Minimum PCB Dimension

5mm x 5mm

Base Material

I-TERA – Tg 200°C

Rogers R04350 – Tg 280°C

Board Thickness – 2 Layer

0.250mm & 0.500mm

Non-Pooled – others available in the online calculator

Board Thickness – 4 layer

1.00mm & 1.55mm

Non-Pooled – others available in the online calculator

Board Thickness – 6, 8, 10, 12. 14 & 16  layer

1.55mm

Non-Pooled – others available in the online calculator

Base Copper Foil– Outer Layers

Pooled – 1L & 2L – 12µm/⅓oz, 18µm/½oz, 35µm/1oz

Pooled – Multilayers – 12µm/⅓oz, 18µm/½oz

Non-Pooled – others available in the online calculator

Base Copper Foil– Inner Layers

Pooled – 18µm/½oz. 35µm/1oz

Non-Pooled – others available in the online calculator

Surface Finish

Pooled – ENIG (Chemical Ni/Au)

Semi-Pooled – Immersion silver (Ag)

Non-Pooled – LF HAL

Soldermask Type/Colour

Pooled – Green

Non-Pooled – Red, Blue, Black White, Transparent, PixtureBlackWhite

Extra Options

Pooled – Peelable mask, Via filling, Heatsink Paste Hard-gold fingers

Semi Pooled – Gold Edge Connectors

Non -Pooled – carbon pads

Legend Colour

Pooled – White

Non-Pooled  – Black, WhitePIL

Min. Track width/Spacing

Pooled – 0.100mm

Non-Pooled – 0.090mm

Min. Finished Hole Size

PTH – 0.100mm

NPTH – 0.200mm

Non-Pooled – others available in the online calculator

Minimum Outer Layer Pad Diameter = Finished Hole Size + Listed Value

PTH – 0.300mm

NPTH -0.200mm

Minimum Inner layer Pad Diameter = Finished Hole Size + Listed Value

PTH  – 0.350mm

NPTH -0.250mm

Minimum Copper to Board Edge Clearance – Outer layers

Routed – 0.250mm

V-cut – 0.450mm

Minimum Copper to Board Edge – Inner Layers

Routed – 0.400mm

V-cut – 0.450mm

Copper Options

Copper up to Board Edge

Plated Holes on Board Edge

Round-edge Plating

Slots and Cut-outs

Tool Sizes – 0.5, 1.2 & 2.0mm

Delivery Panels (customer panels)

Break-routed with 2 mm Tool or V-cut

Maximum Customer Panel that can be eC-compatible

Pooled – 350 x 250mm

Multilayer Build

Standard, eC-type 8, eC-type 9

For specials request a quotation

Electrical test

Standard

UL Marking

Not yet available

Stencil Material

100µm and 130µm Stainless Steel

Maximum Stencil Size

595mm x 595mm

The RF pool service starts with Default Values, as described in this article

RF pool Assembly Service Parameters

Number of Component Layers

1 or 2

Quantities

1 Piece and Onwards

Lead Time

10 working days (5 for manufacture and 5 for assembly)

Minimum PCB Dimensions

5mm x 5mm

Maximum Customer Panel

326mm x 426mm

Assembly Type

SMT – single or double sided

THT – single or double sided

SMT + THT Mixed Technology – single or double sided

Components

Passive Components  – 0201 and higher

Active Components – from 0,35mm pitch

BGA – 0,4mm pitch and above

Solder Alloy

Basis SAC 305 Sn 96,5 Ag3 Cu 0,5 lead-free

Solderpaste Stencil

Laser cut

(included in the assembly cost – not delivered with the assembled boards)

Component Sourcing

All Components Sourced by Eurocircuits

(Components not sourceable by Eurocircuits can be supplied by the customer)

Quality Inspection

Visual inspection

Solderpaste Inspection (SPI)

BGA Placement

X-ray Inspection