The first step in the plating process is the black hole process, this deposits a thin layer of conductive carbon (nanometres) on the barrel of the holes (only those defined as PTH). The carbon provides a conductive surface for the plating of the holes during the galvanic process where approximately 25µm of copper will be plated on the barrel of the holes (only those defined as PTH).
The process steps for the black hole are:
- Clean
- Rinse
- Carbon deposit
- Dry
- Micro-etch
- Rinse
- Dry
Return to the process overview – Making a PCB – PCB Manufacture step by step
