There are 2 main categories for components and mounting technology, Through Hole and Surface Mounted.
Through Hole Technology (THT) is the original assembly process that dominated the industry until the invention of Surface Mount Technology (SMT) in the mid 80’s.
One of the soldering techniques for THT is the use of Selective Wave Soldering.
Selective soldering is a variant of wave soldering, the equipment makes a small solder alloy wave within a nozzle and moves this wave to the THT joints that are to be soldered. Selective soldering consists of three steps:
- Application of liquid flux
- Preheating of the printed circuit board
- Soldering with a specific solder nozzle.