Script – X-ray Inspection
We use X-ray evaluation for process control and failure analysis. The equipment we use is a Nikon XT V160 with an open tube microfocus X-ray source.
X-ray evaluation is a non destructive method to visualise parts that are typically hidden from view.
The system provides a real-time live 2D image, and has the possibility to construct 3D images as well.
The whole process is controlled by an internal software. With this tool we can inspect all types of SMD components and their solder joints. In practice we check the position and solder joints on BGA, micro BGA, LGA and QFN components.
X-ray inspection is a time consuming process, not all boards are inspected.
We inspect the first boards and other assembled boards on a sample basis. The X-ray inspection is part of the process control in our quality management system.
The machine can create a real picture of the inner structure of the solder alloy, showing how many voids are there in a solder joint.
The images can help us also to analyse root causes of detective boards, such as excessive solder, lack of solder, mechanical failures of components, cracks, but also to detect hidden problems inside the PCB, such as bad metallisation in the holes or via cracks.